Ted and Cohorts,  We've been running the SHADOW process in production 
     of 55110 boards since Feb. of 95.  Never have we accepted Shadow at 
     the interconnect.  We scrap it.  We also use it as a process 
     indicator.  Which, if you do have it, indicates something is not right 
     in the process.  Like the etch is not etching or the original C 
     deposit was too heavy or the air-knife is not knifing etc.etc..  Many 
     things can lead to this problem, but, this process, just like most 
     processes can be set up to run excellent product consistently.  This 
     is not a fire-and-forget process. (Yes, we make missiles.)  But heck, 
     I believe with a good SPC strategy in place you can even make a 4 
     component electroless copper line run defect free.  And, with the same 
     attention to these direct metalization processes as given to the 
     monster electroless line I'm sure noone has to live with 
     carbon/graphite at the interconnect.   
     
     Slater!  [log in to unmask]

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