Mohit,

We have a 'Process Monitoring & Yield Improvement' kit that can be 
integrated into SPC systems. The kit comprises a set of spreadsheets 
measuring the different stages of the assembly process, a defect 
guide and full instructions on how to use the kit. There is also an 
optional diskette containing the spreadsheets on Lotus 123 and an 
instructional video.

We also have a book publication entitled 'Manufacturing Techniques 
for Surface Mounted Assemblies'  which has a large section devoted to 
SPC.

If you are interested further information on either of these 
publications, please send me your full address and fax number.

Regards,

Trevor Galbraith

> Date:          Thu, 22 Aug 96 10:06:02 PST
> From:          "MohitGujral" <[log in to unmask]>
> To:            [log in to unmask]
> Subject:       SPC Procedures

> I am in the process of upgrading SPC techniques to our facility. Was 
> wondering if anyone would have any ideas on how to improve, measure 
> and implement SPC techniques to the placement and  reflow processes.  
>      
> I did a lot of study on the printing process and I think with proper 
> measurements of solder paste volume and stencil openings - problems 
> like insufficient and bridging can be solved.
> Your ideas, comments, advise on placement and reflow processes would 
> be much appreciated.
>      
> Thank-you
>      
>      
> Mohit Gujral
> QA Engineer
> Solectron
>      
> [log in to unmask]
>      
> Ph 408 957 2757
> Fx 408 957 2645
> 
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Tel: +44 (0)1624 844888
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