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| Date: | 19 Nov 1996 08:28:21 -0600 |
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The EPA and IPC and industry used this test in the recent Design for the
Environment Program t o evaluate various alternatives to electroless copper,
There is a paper, and I am not sure it is published yet, by Deborah Boger,
Bill Burch and Susan Mansilla titled U.S. EPA-IPC Design for the Environment
Program Making Holes Conductive Performance Testing Results that uses this
technique to evaluate interconnections. It has many pages of results using
this technique. How to do it is in a proposed IPC TM 650 procedure 2.6.26
now circulating for preapproval comments.
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From: [log in to unmask]
To: [log in to unmask]
Subject: Re: GEN: Heard of Interconnect Stress Testing (IST)?
Date: Monday, November 18, 1996 11:50PM
Interconnect Stress Test (IST) is a quality test for plated-through holes
and
vias using resistance heating to thermal cycle the PTH/vias. The method is
rapid (Much faster than oven thermal cycling) and produces the same failure
modes as does thermal cycling. An IPC round robin test has been underway for
some time to determine if the IST-results correlate with thermal cyclic
results sufficiently to allow reliability predictions from them. The
correlation is as yet not established.
Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ 07945 USA
Phone & Fax: 201-543-2747
E-Mail: [log in to unmask]
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