Lou,

                How important is compensation.  Well.....That all depends
        on the technology of the product you're building. If you have pad
        sizes that are >.014" over the drilled hole size then it may not
        be so critical. If your trying to get to drilled hole size +.006".
        Well....Then it's vital.

        I'll add two more variables to your list.
        #1 (The most important one) Quantity up on a panel. I'm seeing
           more and more smaller parts. (I think due to die shrink stuff.)
           The multiple up plane layers <at some point> start behaving like 
           signal layers due to copper density.
        #2 Core thickness. (Remember the same prepreg we use to relam is
           what is used to make the cores. 1060 shrinks a heck of a lot more
           than 7628.)

        Your other comments/observations are correct. The other variables
        all have valid influence/impact on dimensional movement within a
        multilayer package. The object is "how do we accurately predict"
        or "model" all these variables?  I started with a scaling matrix of
        5 and now have 10 and still haven't got it where I feel completely
        comfortable. I think that number may double shortly <for me anyways>.

        Good Luck!

        (Always in search of registration.)

        Groovy
______________________________ Reply Separator _________________________________
Subject: FAB:  Film compensation
Author:  [log in to unmask] at SMTPLINK-HADCO
Date:    8/5/96 3:38 PM


Here's a question for TechNet that may be vague and imprecise, but I 
will ask it any way.  It has to do with film compensation for inner layers.

Our plant compensates inner layer films according to simple rules:  add 
0.5 mils/inch and 0.3 mils/inch for ground planes in the grain and 
non-grain directions, respectively;  add 0.6 mils/inch and 0.4 mils/inch 
for signal planes in the grain and non-grain directions.  

The engineering 
team believes that these rules, made 4 or more years ago, are too simple.
Some factors that, we believe, should affect compensation are

- layup pattern, location of ground and signal planes in the board stack

- weight of copper (could be many variations here)

- number of layers

- trace density

- orientation of traces with respect to grain

- prepreg styles used (many variations seem possible here)

- supplier of prepreg

- type of material (polyimide, epoxy formulation).

Anyone have any ideas of the relative importance of these factors?  
Anything we have overlooked?


How important is it to be concerned about compensation?

Lou Hart Compunetics

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