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| Date: | Wed, 23 Oct 96 11:40:40 PDT |
| Content-Type: | text/plain |
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We are trying to improve our solderability acceptance testing on PCB's
(esp. on surface-mount pads with the Electroless Ni/Immersion Gold finish)
and would like input from SMT shops:
A. Which solderability test method (i.e. Wetting Balance, SERA, IPC Edge
Dip, etc.) do you want your PCB vendor to conduct on Electroless
Ni/Immersion Au boards? On HASL? On OSP?
B. How do you screen incoming lots of boards for solderability?
c. How do you use PCB solderability testing to improve SMT?
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