TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
James Johnson <[log in to unmask]>
Date:
Mon, 11 Nov 1996 13:05:39 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (18 lines)
Specifically I am looking for an industrial standard for the packaging 
and shippment of printed circuit board assemblies to prevent ESD damage 
in handeling.  I looked through your online list and did not se anything.

Thank You,
Jim Johnson
AFP Imaging
e-mail [log in to unmask]

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2