I would like to send or fill out over the phone a questioneer for all
users of tsops having alloy 42 leads who have experienced problems with 
stressed or cracked solder joints on pwas. We had stress lines  develop in 
solder joints after convection reflow when we had bulbous solder joints.
Reducing stencil apertures to (19.7 mil pitch) 10 mil width with 50% length
using a 6 mil thick stencil rather than an 8 mil stencil gave solder joints
with heel fillets and a 50% toe fillet that survived the reflow process but
they showed stress lines after wave soldering. Hand solder repair of cracked
joints appeared to remedy the situation.

   E.Louis
   Lockheed Martin Corp.
   11 Federal St.
    OPS-2C
    Camden,N>J> 08102
    phone#:609-338-3508 
    fax #: 609-338-2575

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************