We have a vendor that is having trouble securing components during a 
     wave soldering operation(as the board passes over the solder wave). On 
     DIP through-hole DIP packages they can not clinch the pads due to 
     trace proximities inherent on the board lay-out. 
     
     Is anybody familiar with methods (fixturing, water-soluble adhesives, 
     etc,) that can be used for securing components aside from lead 
     clinching? 
     
     DDrake