TECHNET Archives

1996

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Lead stress due to thermal spreaders
From:
Bill Gaines B160 x2199 <[log in to unmask]>
Date:
Tue, 16 Jan 96 08:36:19 PST
Content-Type:
text/plain
Parts/Attachments:
text/plain (20 lines) 

I am looking for references for calculation the solder joint life 
for a Hybrid (600 ctr, dip) with a copper spreader between the
Hybrid and the pwb.

Bill Gaines
AeroJet (for $)         IHPVA   (for speed & fun)
IEPS    (for info)      SCCA    (for trophys)    
[log in to unmask]
===================================================
   /| _  _   _
  /_||_ |_  | 
 /  ||_  _| |_
===================================================
1100 Hollyvale MS:8711 160-2B8
Azusa, Calif. 91702-0298
818-812-2199

ATOM RSS1 RSS2