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1996

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Subject:
sm-tc-001
From:
[log in to unmask] (Loyal Employee )
Date:
Fri, 28 Jun 1996 08:13:12 -0700
Content-Type:
multipart/mixed
Parts/Attachments:
NCZ0C5D.TMP (-1 MB) , fpt.txt (-1 MB) 






Hello,
	I have a copy of Charles L. Hutchins, book 'Understanding
and Using Surface Mount and Fine Pitch Technology' 1993. It indicates
in IPC SM-TC-001, Fine Pitch Technology includes IC packages with
lead spacing 0.004" - 0.020" (0.1mm to 0.5mm).
	Is this still true or has this lead spaceing range been re-
catagorized as Ultra Fine Pitch in the IPC liturature.

Tim Cables

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