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Subject:	FAB: Resin in via
From:	[log in to unmask] ( YAP CHOW LAN)
Date:	Thu, 8 Aug 1996 10:30:08 --800
Content-Type:	text/plain
Parts/Attachments:	text/plain (14 lines)

Has anyone been working on resin-in-via before? I would like to know more
detail concerning this.  I understand that resin is used to fill up the vias so that solder will not flow through the exposed pads, this allow via-in-pad concept to be workable.  What type of resin is this? Where and how is this process done during fabrication?

Any info is appreciated.

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