Bob, 

Thanks for the info on the ITRI experiment regarding the testing of breakouts
at the interconnect of via holes.  It should give us all some real
reliability data to base our decisions on.  Hopefully this will be available
for the upcoming new specification on rigid board performance, IPC-6011and
IPC-6012.  Note: For those interested there is a interim meeting on these
specification is on June 25-26 at the IPC headquarters. Notice should be out
next week along with your most recent updated proposal of IPC-6011and
IPC-6012.

Phil Hinton 
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