Alternative solder alloy for a special process application (2 Messages)
Anyone have problems with Waving case size "A" Tant or SOT-23's (1 Message)
Are U Square or Round or Oval (1 Message)
ASS. Reliability of solder bonds (3 Messages)
ASSEM (1 Message)
ASSEM--PCB Marking Methods (3 Messages)
ASSEM: Re: FW: Dry Storage (1 Message)
ASSEMBLY- Looking for relay mounting clip (2 Messages)
assy - loctite hardware on pcb assemblies (3 Messages)
Assy Supplier Qualification (3 Messages)
ASSY, rework of damaged QFP leads (1 Message)
ASSY, solder thieves (3 Messages)
ASSY- CONFORMAL COATING (1 Message)
ASSY/DSN: Minimum Spacing (1 Message)
ASSY: 45 degree oriented QFP (1 Message)
ASSY: AOI, Xray, automated solder joint inspection (1 Message)
ASSY: Are U Square or Round or Oval (7 Messages)
Assy: Au/Pd/Ni/Cu PCB Finish (8 Messages)
Assy: conformal coating (1 Message)
ASSY: CONFORMAL COATING BGAs (3 Messages)
ASSY: Genesolv replacement (3 Messages)
ASSY: ITT Canon (1 Message)
ASSY: MOLE temperature probes (2 Messages)
ASSY: Rework Method (2 Messages)
Assy: Solder Heat Resistance (1 Message)
ASSY: Solder joint strength (2 Messages)
Assy: Tantulam Powder (1 Message)
ASSY: TQFP JEDEC TRAYS (1 Message)
Assy: vapor phase secondary fluid (1 Message)
ASSY: VIA_Wetting (1 Message)
ASSY: Wave solder defect rates: (was: Hot Air Knife a (1 Message)
ASSY: Wave solder defect rates: (was: Hot Air Knife after solder pot?? Anyone use this?) (2 Messages)
ASSY: Wave Solder sand Bags (1 Message)
ASSY: Wavesoldering questions... (2 Messages)
Assy: white residues (2 Messages)
ASSY:Au/Ni Coated Boards (1 Message)
ASSY:Coplanarity (2 Messages)
ASSY:Ionic contamination specs (5 Messages)
Assy:VIA_Wetting (1 Message)
Au/Pd/Ni/Cu PCB Finish (1 Message)
Automated Optical Inspection (AOI) of PCB inner layers (3 Messages)
BGA Pad design (2 Messages)
BLIND AND BURIED VIA (3 Messages)
Blue fr-4 (1 Message)
Bob Ziedmans Email ID (1 Message)
Bowing off Tantulam Caps (5 Messages)
Buried capacitance material (2 Messages)
Carbon Ink Resistors (1 Message)
cc:Mail Link to SMTP Undeliverable Message (3 Messages)
change e-mail address (1 Message)
Chlorine damage to electronics (fwd) (4 Messages)
Cleaning with Ultrasonic (1 Message)
Cleanliness of assembled boards (3 Messages)
Co-planar Waveguide question! (1 Message)
Coax plating (1 Message)
component (1 Message)
CONFORMAL COATING (5 Messages)
Controlled impedance documents (2 Messages)
Copper and Phosphate (1 Message)
Copper recycling (2 Messages)
Cross Section Service (4 Messages)
Cu/Ni/Pd/Au finish (1 Message)
Dazor (1 Message)
DEC Alpha Motherboards (1 Message)
DES- PTH Mathematical Mo (1 Message)
DES: Heatsinking SMD OpAmp (1 Message)
DES: High Cycle Fatigue Properties of Solder (1 Message)
DES: I/O Terminations (1 Message)
DES: Panelization (7 Messages)
DES: PTH Mathematical Model (2 Messages)
DES: PTH Mathematical Model -Reply (1 Message)
DES: Track spacing for 100V on internal layers (1 Message)
DES: Track spacing for 100V on internal layers -Reply (3 Messages)
DES:I/O Terminations (2 Messages)
Design, Fab & Assembly - BGA, vias and power planes (1 Message)
Did Technet disappear (1 Message)
Document IRD-DES 003 (1 Message)
double sided reflow-soldering top side to bottom side (1 Message)
double sided reflow-soldering top side to bottom side parts. (3 Messages)
Double Soldering? (2 Messages)
Double Soldering? -Reply (1 Message)
Dry Storage (4 Messages)
E-Mail massages (2 Messages)
Electrochemical migration (2 Messages)
Electroless Deposition (1 Message)
EMC Analysis S/W (2 Messages)
Emma 210 Driver (1 Message)
Employment chatter (4 Messages)
ETS300-019-1, 2, and 3 (1 Message)
Excellon SMX programing (1 Message)
Expert Systems (3 Messages)
fab (3 Messages)
FAB - chemical and physical properties of PCB board material (2 Messages)
FAB and ASSY: Spec for Electroless Ni and Immersion A (1 Message)
FAB and ASSY: Spec for Electroless Ni and Immersion Au (4 Messages)
FAB equipment, non-contact pyrometer (2 Messages)
Fab/Assy: Decapsulant method (2 Messages)
FAB/ASSY: PCMCIA (1 Message)
Fab: Addition of Controled Impedance Conductors (1 Message)
FAB: APM Radiometers (4 Messages)
FAB: conveyorized 'durabond' (2 Messages)
FAB: Copper foil compatability (1 Message)
Fab: CRM5 Material (2 Messages)
fab: drilling (3 Messages)
Fab: Drilling/routing dust (1 Message)
FAB: Etching Double-Treat foil. (2 Messages)
FAB: Hole tolerances (1 Message)
Fab: Horizontal Oxide Line (2 Messages)
FAB: Instrument for PTH Cu measurement. (1 Message)
FAB: Lap shear test (3 Messages)
FAB: LPI (3 Messages)
Fab: LPI soldermask (1 Message)
FAB: Material - FR10 (4 Messages)
FAB: Material ; G-10 (5 Messages)
FAB: Material Certificate? (1 Message)
FAB: Plating Thickness inside hole walls ; reliability of measurement (1 Message)
FAB: RE: Question on Pad Leveling (8 Messages)
Fab: Rinse water quality (4 Messages)
FAB: tin only over copper on antenna design (3 Messages)
FAB: Unbalance Copper Core (1 Message)
Fab: Wanted PWB Shop to Purchase (1 Message)
Fab:Disposal of drilling/routing dust (1 Message)
FAB:Resin Removal from Tooling holes (2 Messages)
Fab:Router dust (2 Messages)
Fabrication (1 Message)
FEB- ceramic BGA crackin (1 Message)
FEB: ceramic BGA cracking after wave solder (2 Messages)
GEN - Image processing for PCB inspection (1 Message)
Gen- Durometer Measurement (1 Message)
Gen: R&D (2 Messages)
GEN: S.M. adhesives (1 Message)
GEN: SUPPLIER (2 Messages)
Gen: Wanted,Tackroller (4 Messages)
Gen: Wanted,Tackroller -Reply (1 Message)
General: Vision Inspection of Built Up Assemblies (3 Messages)
General: Vision Inspection of Built Up Assemblies -Reply (1 Message)
Glaser DP3545 Photoplotter (1 Message)
Globtop Decapsulation (2 Messages)
Gold Finger Touch Up (4 Messages)
Gold/Tin-soldering (2 Messages)
HALT / HASS physical stress systems (3 Messages)
Hasl thickness... (3 Messages)
Hello... (1 Message)
High Cycle Fatigue Properties of Solder (2 Messages)
Hot Air Knife after solder pot?? Anyone use this? (5 Messages)
How do you use Material Certificate? (2 Messages)
Idents and HASL (1 Message)
Idents before or after HASL (4 Messages)
Idents before or after HASL-- Reply (1 Message)
IMS Material (3 Messages)
INFO: Charles Hutchins (1 Message)
INFO: Charles Hutchins -Reply (1 Message)
Insulation Displacement Connectors (2 Messages)
Intrusive Reflow (3 Messages)
Ionic contamination specs (1 Message)
IONIC TESTING (2 Messages)
IPC-A-610B Quality Levels (1 Message)
IR Reflow Ovens & Wetting Balance (1 Message)
ISO Discussion Forum (1 Message)
ISO9002 (5 Messages)
ISO9002 (fwd) (1 Message)
John Sohn: Out of Office AutoReply: Cleanliness of assembled (1 Message)
Koax plating (1 Message)
LCC (1 Message)
LCC Solder Joint (7 Messages)
Linguistics (2 Messages)
Looking for CAD software (1 Message)
Looking to buy used CAD software (1 Message)
LPI soldermask (1 Message)
LPISM Stripping (9 Messages)
LPISM Stripping -Reply (1 Message)
LPSIM Stripping (2 Messages)
Mailbox getting too full from TechNet?? (1 Message)
me too..... (1 Message)
Measuring QFP Lead Pitch (2 Messages)
Message not deliverable (2 Messages)
MIL-P-11268 (2 Messages)
Mill Dies (2 Messages)
Minimum gold plating on gold tabs (2 Messages)
Minimum gold plating on gold tabs -Reply (1 Message)
Modifications to PCBs with 30AWG wire... (4 Messages)
N2-bags (3 Messages)
Need Carbon Capability Prototype Fab Shop. (2 Messages)
New Printed Wiring Board Technology (2 Messages)
Nitto Tape (5 Messages)
No-clean/Test Probes/Cleaning (2 Messages)
Non-halogenated fore retardant additives for laminates (1 Message)
OSP (1 Message)
palladium plating (4 Messages)
paste measurement (2 Messages)
Patent Search Web Site (6 Messages)
PC Cards (2 Messages)
PCB Lacquer (1 Message)
PCMCIA STANDARDS (2 Messages)
PEM reflow (2 Messages)
PHOTOPLOTTER 4 SALE + PROBIMER LINE (1 Message)
placement system (1 Message)
PLASTIC RIVET MACHINE SUPPLIER (3 Messages)
Plating over Monel (1 Message)
plugged vias (5 Messages)
Press Pin Assembly Equipmen (2 Messages)
Press Pin Assembly Equipmen -Reply (1 Message)
Preventive Maintenance Software (1 Message)
Previous Message By Myself (1 Message)
Price Fixing and Restraints of Trade (2 Messages)
Primary Image ( outer layers ) (1 Message)
Profiling PCB's (2 Messages)
PTH Mathematical Model (1 Message)
Pumice Source (1 Message)
QS-9000 standard (3 Messages)
Question on Pad Leveling??? (1 Message)
R: Pumice Source (1 Message)
Raw Flex Manufacture (2 Messages)
Raw Flex Manufacture; Please read (1 Message)
removing solder mask (5 Messages)
Reply: Conformal coating (1 Message)
Research Associate Vacancy (1 Message)
Resin Removal (3 Messages)
RF Design (5 Messages)
RF Design - Plating and Routing (2 Messages)
Rinse water quality (1 Message)
Rinse water quality (graphs and formula) (1 Message)
Roku-Roku Sangyo, Ltd. (1 Message)
S/M Tack Cure Racks (2 Messages)
Silkscreening (2 Messages)
SMT Assy Equipment (1 Message)
Solder Balls (4 Messages)
Solder joint strength (1 Message)
solder mask (3 Messages)
Solder Mask CTI Rating (2 Messages)
Solder Precoat (1 Message)
SOLDERABILITY OF IMMERSION GOLD (2 Messages)
Solderability Tests of Boards (5 Messages)
Soldering to Nickel Plate (1 Message)
Soldering to Nickel Plate -Reply (1 Message)
soldermask stripping (1 Message)
Solution: No Solder on Size "A" Tant Caps after WAVE also (2 Messages)
Solution: No Solder on Size "A" Tant Caps after WAVE also SOT-23's (2 Messages)
STD: IPC-6012 - Dewetting Definition (3 Messages)
Subject: Solution: No Solder on Size "A" Tant Caps after WAVE also SOT-23's (1 Message)
subscrib (1 Message)
Supplier (1 Message)
Supplier Edge connectors (1 Message)
Supplier of polymer solders (5 Messages)
Surface Mount Devices (1 Message)
Tantulam Powder (1 Message)
Taping machines (1 Message)
Tented Via Reliability (2 Messages)
Tented Via Reliability -Reply (5 Messages)
Tented Vias (4 Messages)
Test probes for gold fingers (1 Message)
Thermal Retesting After Replacing ICs... (2 Messages)
tim strip issue (3 Messages)
Timeway Program (1 Message)
Tin / HASL (3 Messages)
Tin as an etch resist (4 Messages)
Tin strip issue (2 Messages)
TMA and TGA testing (3 Messages)
Touch up Ink for Outer layers (1 Message)
Touch-up (2 Messages)
Training-Certification (1 Message)
Translator for Allegro (1 Message)
Translator to Allegro (1 Message)
Ultrasonic Cleaning (4 Messages)
UNE Specification (3 Messages)
Unidentified subject! (1 Message)
Unknown adhesive (1 Message)
Used Equipment - From ex-PCB manufacturer (1 Message)
Via Plugging (4 Messages)
Via Reliability (1 Message)
Vision and X-Ray inspection of assemblies (1 Message)
waterbased flux (1 Message)
Waterbased Flux AND N2 Bags (1 Message)
Wave Solder (2 Messages)
Wave Solder Approach - a SURVEY (4 Messages)
Wave solder approach - A survey. (2 Messages)
What is black alloy plating? (2 Messages)
What is ED? (3 Messages)
Where is SirGuru (4 Messages)
White Residues and "J" leads (1 Message)
[Fwd: Mousebites/divots] (5 Messages)