Thought I had sent this out once before. 
Sorry if this is a repeat ... 

We have a product requires thermal testing -

 50 degrees C
 Power ON
 full functional setup
 total high temp time = 72 hours

PRIOR to electronic bench testing. We do this to weed out
an infant mortality with board assembly, bad chips, etc...

Now, if the bench test discovers or as indicated by front
panel leds some failure and some rather large ICs
need to be replaced, does the entire assembly go back
through full cycle temp testing?

This could have a major impact on stock and ship quantities.
Plus only so many products can go in the chamber. Any
retest knocks out *new* products coming through in the
regular flow.

Comments, thoughts, even speculations welcome.

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