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June 1997

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Subject:
RE: Question on Pad Leveling???
From:
"Kearney, Donald J (RFC MS-Mail)" <[log in to unmask]>
Date:
Thu, 12 Jun 1997 09:39:00 -0400
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Hello,

I have a question regarding pad leveling (solder coating on circuit
board pads).

What is max and min dimensions for the solder coating???

Where can I find this specification???

Evaluating printed circuit boards is very new to me.

I appreciate your patience and thanks in advance,

Don Kearney
Harris Corp.

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