I'd recommend you fill them with solder if you can.  Coating can be used, but
its best if you do this AFTER a protective coating is applied to the board like
Hot Air Solder Level (hasl) or on a patern plated board (SnPb plated) from
which you DO NOT strip the Sn Pb .

See my other append about solutions getting trapped in the vias.


If at all Possible DO NOT Plug/Tent/Fill vias with anything other than a solder
like material that fills them 100% of their depth.

hope that helps

Jim Herard
IBM Microelectronics
Quality Engineering
[log in to unmask]
---------------------- Forwarded by Jim Herard/Endicott/IBM on 06-11-97 08:39 AM
 ---------------------------

        suixin @ elis.rug.ac.be
        06-10-97 03:59 PM
Please respond to [log in to unmask] @ internet


To: TechNet @ ipc.org @ internet
cc:
Subject: via plugging

Hello, everybody
I want to get some information on via plugging technology. In my
work, the plated through vias are 1.6mm deep and 300 micron in
diameter. I have to plug them before further processing. Any input
will be greatly appreciated.
Thanks in advance.
suixin zhang
ELIS-TFCG/IMEC, University of Ghent
Sint-Pietersnieuwstraat 41, B-9000 Ghent, Belgium
tel: 0032-9-2643371
fax: 0032-9-2643594
Email: [log in to unmask]

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