 
| Mime-Version: |
1.0 |
| Content-Type: |
text/plain |
| Old-Return-Path: |
|
| Date: |
Wed, 11 Jun 1997 08:45:16 -0400 |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| From [log in to unmask] Tue Jun 17 10: |
41:21 1997 |
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"O7j4O.0.W-L.Khfdp"@ipc> |
| Subject: |
|
| >From willli Wed Jun 11 07: |
32:41 1997 |
| X-Loop: |
|
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0wbmZZ-000BjMC; Wed, 11 Jun 97 07:32 CDT |
| From: |
|
| Message-Id: |
<5010400004220156000002L062*@MHS> |
| Parts/Attachments: |
|
|
I'd recommend you fill them with solder if you can. Coating can be used, but
its best if you do this AFTER a protective coating is applied to the board like
Hot Air Solder Level (hasl) or on a patern plated board (SnPb plated) from
which you DO NOT strip the Sn Pb .
See my other append about solutions getting trapped in the vias.
If at all Possible DO NOT Plug/Tent/Fill vias with anything other than a solder
like material that fills them 100% of their depth.
hope that helps
Jim Herard
IBM Microelectronics
Quality Engineering
[log in to unmask]
---------------------- Forwarded by Jim Herard/Endicott/IBM on 06-11-97 08:39 AM
---------------------------
suixin @ elis.rug.ac.be
06-10-97 03:59 PM
Please respond to [log in to unmask] @ internet
To: TechNet @ ipc.org @ internet
cc:
Subject: via plugging
Hello, everybody
I want to get some information on via plugging technology. In my
work, the plated through vias are 1.6mm deep and 300 micron in
diameter. I have to plug them before further processing. Any input
will be greatly appreciated.
Thanks in advance.
suixin zhang
ELIS-TFCG/IMEC, University of Ghent
Sint-Pietersnieuwstraat 41, B-9000 Ghent, Belgium
tel: 0032-9-2643371
fax: 0032-9-2643594
Email: [log in to unmask]
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|
