Hi,Technetters!

Could anybody comment on solderablity of immersion gold on electroless
nickel ?
What is the influence of the phosphorus content on the solder joint
reliability?
Some people say that phosphorus content up to 8% is beneficial for the
solderability.I heard  the opposite too.
What about having to change the reflow profile to a peak of 240
degrees in order to enhance its dissolution in solder?
And about press fit connectors in immersion gold plated holes:
Are there specifications from vendors concerning hole diameters,nickel
thickness,immersion force,aso?
Thank you,
Gaby

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