Hello Technet!
     We are in the process of implementing a no-clean/low-residue process 
     in a Class 3, High Reliabiity, manufacturing process.  Obviously I 
     have some soul searching questions.
     
     First, I see the need to clean.  Hopefully with a low cost cleaning 
     process.  Why?  If all the no-clean process is in place, general 
     statement, and parts come in that cause failure after cleanliness 
     testing, then, "how do the boards get cleaned?"  Yes, one should have 
     their suppliers online, but, this can be a cruel world sometimes and 
     scrapping them isn't an option.  
     
     Second, test probes at Incircuit test.  Is there a no-clean flux that 
     can be probed without having to replace test probes?  Many suppliers 
     claim their no-clean is probeable, but, there is a significant cost 
     because of the residues left on the probes.  This can get very 
     expensive.  Our existing Incircuit test process with cleaned boards is 
     very inexpensive.  If there is a no-clean flux out there, would the 
     users be willing to share the brand name, or even entertain a 
     benchmarking visit?  Low-residue fluxes/pastes could be used, but, I 
     have heard this makes a nitrogen process necessary.  Nitrogen 
     processes can also be very expensive.  Can a low-residue process be 
     used without nitrogen if the components/boards are solderable 
     (solderability good)?
     
     Third, how many have "skunk works"?  By this I mean, "how many have 
     cleaners in the back room for those problem child 
     boards/processes/products?  We have some special products that must be 
     cleaned...i.e...space, high voltabe power supplies, etc.  Need some 
     help/suggestions/advice (please keep it clean so to speak).  Thanks.
     
     I see the need to have a cleaning operation somewhere inhouse and 
     possibly in the production process.  Looking at costs:  First, it 
     would seem that costs at Incircuit would get pretty salty if you had 
     to continually change/clean test probes.  Second, to use a low-residue 
     flux/paste nitrogen requirements can off set savings by going to a 
     low-residue technology.  Third, I can't scrap boards if they fail 
     cleanliness because a supplier forgot to clean them.
     
     We would like very much to transition to a no-clean/low-residue 
     technology (no-clean or low-residue).  I am not a against this 
     technology, so please don't misunderstand this e:mail.  I feel that 
     no-clean may not really mean "no-clean".  I know these subjects have 
     been on the TechNet before, but could we resurrect them once again?
     
     Thanks for listening, need some feedback.
     
     RON
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