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Subject:	Re: Intrusive Reflow
From:	"Jeffery L. Hempton" <[log in to unmask]>
Date:	Mon, 23 Jun 1997 07:43:34 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (47 lines)

The AMP connector company has a nice section including stencil formulas at 

www.amp.com/product/articles/dd66a.html

Also, visit TEKA interconnection systems, for an alternative to wave OR
pin-in-paste...they sell "solder-bearing leaded devices" like connectors,
that are pre-loaded with solder. They have a homepage at

W3.BBSNET.com/TEKA

Also, EMPF hosted an SMTA presentation on this topic in January of this year
in Indianapolis that was quite informative...contact them for possible copies.

We have implemented PIP with good success. If you still have questions, Feel
free to contact me directly.

Jeff L. Hempton        phone: (219) 429-7335   Fax: (219) 429-4688
Boardshop Manufacturing Engineer			Mail Stop: 25-31
Hughes Defense Communications                           
1010 Production Road, Fort Wayne, IN 46808-4106
Email: [log in to unmask]

"The man who rolls up his sleeves seldom loses his shirt."--Thomas Cowan

At 12:31 PM 6/19/97 -0400, you wrote:
>Can someone suggest a source of information on Intrusive Reflow or the Pin
>in Paste process?  I have inquiries from several customers whom would like
>to explore this technology and are looking for general information and
>guidelines on how to set up experiments for this technique, on stencil
>design, or speak with Process Engineers familiar with the technique. 
>Thanks,
>Denis Meloche
>Heraeus Inc
>610-825-6050   
>

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