Has anyone out there implemented, in high-volume production, a horizontal
replacement for conventional black or brown oxide ('durabond' or equiv.)
in-line with D/E/S, i.e. effecting the [efficient] route:
Image/Dev/Etch/Strip/Tin/PE-Punch/AOI/Lay-up?  If so, how well does the imm.
Sn withstand handling damage?  Must there be some sort of aqueous cleaning
after AOI prior to Lam?  Are bond strengths acceptable & do they pass
thermal testing?  Have customers/designers voiced concerns about long-term
reliability?  Is there any effect, good or bad, on signal integrity, esp. at
high speeds?

J.Felts

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