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Date: | Tue, 10 Jun 1997 14:13:05 -0500 |
Content-Type: | text/plain |
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Address,
There's been a lot of discussion lately on Tantalum caps. I think all
of us have had one or more problems with these types of caps. I like
to throw another out on the table.
We're planning on minimizing the quantities of 0603 and 0805 tantalum
caps that are used on our PCMCIA. We've tried several footprints to
minimize the amount of tombstoning to now avail (all lands being
square).
NOTE: The tombstoning is problematic, but no show stopper.
In our new design, we will be using ceramic 0402's quite extensively.
To better help the assembly process we're discussing the recommended
footprint. I've recommend we continue using a SQUARE/RECTANGLE
footprint, since ceramic caps are symetrical, whereas tantalums are
not. Our designers are considering using OVAL footprints to minimize
tombstoning. They are referencing an article that was written in
EE-Times (12/16/96), that discussed Motorola's approach to minimizing
tombstoning to under 100ppm's. Motorola noted many variables that
could effect the tombstoning even with OVAL land changes. My thinking
on this is that a ROUND or OVAL footprint will have more surface
tension than a square land, assuming some paste volume is constant,
due to the surface area.
Are others using OVAL lands to minimize tombstoning or are you having
successes with using square lands? Also is anyone using triangle
lands for 0402's? Please advise.
Thank you
John Gulley
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