My curiosity is killing me.  I have been reading about Horizontal HAL
thicknesses ranging from coverage on the low side to .0015 on the high
side.  My experience reveals a somewhat tighter range on most QFPs.  

Can someone in assembly tell me what the problems are associated with
this lack of coplanarity?  Is this phenomena creating issues about
planarity of the site, or variances in the amount of free solder left on
the pads?

Thanks in advance,

Mark

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