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June 1997

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Subject:
From:
simon!pbni.attmail.com!PBN!PBN1!JMcGee (John McGee)
Date:
Wed, 18 Jun 1997 17:39:00 +0000
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Text/Plain (57 lines)

Hello Technetters-

Keeping in mind that I'm treating the word "shall" as a "mandatory" 
requirement, how do I reconcile what seems to be a contradiction between 
J-STD-001B , section 9.2.5 and IPC-A-610B, section 4.4 ?


The J-STD-001 states that ...

"Plated through-holes without leads, including vias, after exposure to 
reflow,
wave, dip, or drag solder processing SHALL meet the acceptability 
requirements
of Figure 9-2".  (Figure 9-2 shows that "Acceptable holes" are those where 
"the coated or applied solder has wetted sides of holes")

In 610B, it states ...

"Plated through holes or vias without leads, after exposure to wave, dip, or 
drag soldering equipment SHALL meet all the acceptability requirements of 
the illustrations below".

The accompanying Figures 4-25 and 4-26  illustrate  the "Target Condition" 
and the "Acceptable" conditions, respectively.

And lastly, Figure 4-27 illustrates the "Nonconforming Process Indicator" 
condition, which is described as follows:
"When solder has not wetted sides of holes, it should be considered a 
process indicator as per J-STD-001.  There is no nonconforming defect 
condition for this".

That last sentence seems a direct contradiction.  What is the real story 
here?
Any feedback would be appreciated.

 --John McGee

PBNI
100 Fairgrounds Drive
Manlius, NY 13104
Ph. 315/682/9105 Ext 2430
Fax. 315/682/9006
[log in to unmask]


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