Hi all,

I have a delima I need help with.  Currently we "spotface" or 
mechanically remove resin from around our tooling holes after 
lamination before drilling to make the panels nice and flat and to 
remove surface resin.   In doing this we create 2 problems:

1.  For thinner laminations the amount of material removed may render 
the tooling hole unusable so we sand the resin and are not getting a 
complete removal or achieving flatness

2.  The material exposed by the "milling" or "spotfacing" is rendered 
unplatable without going into a more aggressive desmear or etchback 
process that we do not normally run. This means that the electroless 
plating in these areas flakes off and we are forced to laminate dry 
film over these areas and use secoundary pinning for outerlayer 
registration.   


Question:

Are there other alternatives to "spotfacing"? Especially for thinner 
laminations.

Are there process steps I am missing that may solve one or both of 
these issues?


Thanks,


Doug Jeffery
Electrotek, Inc.

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