TECHNET Archives

June 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Tented Via Reliability -Reply
From:
bob metcalf <[log in to unmask]>
Date:
Tue, 10 Jun 1997 17:16:39 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (43 lines) 
True tented vias can only be achieved using dry film solder mask. Many
people us liquid photoimageable solder mask to "plug" vias. This is fairly
effective but not as reliable as dry film. The liquid method can lead to
entrapment of contaminants as well as not form a 100% reliable plug.
Plugging with a liquid is dependent on both the solder mask and the skill
of the people applying the mask.

Bob Metcalf
Morton Electronic Materials

>>> Frank Hinojos <[log in to unmask]> 06/10/97 04:18pm >>>
     I would like to use tented vias in my designs for the assembly 
     advantages but have heard that the tented via can then act like a 
     trash can which collects contaminants and therefore may cause 
     reliability problems.  Is this rumor founded?  Are there studies?
     
     Frank Hinojos
     Watkins-Johnson Co.

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to:
[log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact  
*
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************


***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************

ATOM RSS1 RSS2