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Subject:	RE: Tin as an etch resist
From:	Terry Zhu <[log in to unmask]>
Date:	Sat, 14 Jun 1997 19:51:38 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (42 lines)

Phil:
	You are right. Solder and tin boards are not compatible with CuCl2 etchant. The reason is that tin is more active metal than copper and hydrogen and tin will replace copper and release hydrogen out in CuCl2+HCl system. Tin itself is oxdized as Sn(2+) and dissolved into solution. Resists used for Cupric chloride etchants are screened inks, dry film, gold and tin-nickle. I do have difficult to explain why Sn-Ni can survive from CuCl2+HCl. Someone else may help me straight it out. 

----------
From: 	[log in to unmask][SMTP:[log in to unmask]]
Sent: 	Saturday, June 14, 1997 6:07 AM
To: 	[log in to unmask]
Subject: 	Tin as an etch resist 

Technetters,

Someone asked me if tin plate could be used an etch resist with the standard
curpic chloride etchant.  I though not, as I have always used ammonical
etchant for tin.  Is this possible.

Thanks 
Phil Hinton 
[log in to unmask] 

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