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June 1997

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Subject:
Ultrasonic Cleaning
From:
[log in to unmask]
Date:
Fri, 6 Jun 1997 14:23:14 -0400 (EDT)
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I have a argument going on ultrasonic cleaning of PWA's with different types
of component.

Several opinions have come up: 
(1) Never ultrasonic clean if you have hybrids with wire bond connections.
(2) Hybrids are OK to clean in an ultrasonic if an encapsulant is used.
(3) Hybrids are OK to clean if they supplier follows standard wire bond
requirements.
(4) Do any of the above rules apply to multichip modules.
(5) Do Ball Grid Array fall in any of the above categorties.

Phil Hinton 
[log in to unmask]    

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