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June 1997

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Subject:
FEB: ceramic BGA cracking after wave solder
From:
Sheila Smith <[log in to unmask]>
Date:
Wed, 11 Jun 1997 11:59:45 -0400 (EDT)
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We are experiencing cracking of large (1.8" on a side) ceramic BGA cracking
(like in half) following wave solder.  The devices are on polyimide boards.
This is a new program -- any advice on things we might do better or
different ... bake the boards before we stuff them?  fixture boards during
wave solder? go back to our board supplier for resolution?  Thanks for any
help...

Sheila Smith, Tracor AES

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