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Date: | Mon, 16 Jun 1997 10:56:27 -0400 (EDT) |
Content-Type: | TEXT/PLAIN |
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LARRY,
PLEASE BE AWARE THAT EPOXY BASED LPSM CANNOT BE STRIPPED AFTER BAKING, THE
SOLVENT NECESSARY WOULD ATTACK THE BUTTER LAYER. ONLY NON-EPOXY CAN BE
STRIPPED EFFECTIVELY, 130-150 F, PH>13 AND WITH AN RBP-CHEMELEX PROPRIETARY
SOLDERMASK REMOVER, ONLY 3 HOURS IS NECESSARY.
BEST REGARDS,
LENNY KURUP
[log in to unmask]
On Sun, 15 Jun 1997 [log in to unmask] wrote:
> I'm not sure if it has tremendously improved over the past two years;
> however, most PWB shops will try to strip LPI masks (even after final cure)
> in preference to scrapping out the boards.
>
> The basic requirements for stripping cured LPI solder masks after final cure
> are:
> 1. High pH (>13.0)
> 2. High temperature (150-180 deg F)
> 3. Patience (it could take up to 48 hours)
>
> A number of companies have proprietary solder mask strippers on the market
> which work well. Examples would include: Alpha Metals, Oliver Sales, Dexter
> Electronic Materials, etc.
>
> Hope this helps
>
> Larry Fisher
> Dexter Electronic Materials
> [log in to unmask]
>
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