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June 1997

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Subject:
ASS. Reliability of solder bonds
From:
Martin Farrell <[log in to unmask]>
Date:
Mon, 09 Jun 1997 10:53:57 +0000 (GMT)
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Does anyone know of articles, reports etc regarding the reliability of the
Cu-Ni-Sn/Pb solder bond in comparison to the Cu-Sn/Pb solder bond. (The Ni
plating is an electroless deposit).

Martin Farrell (Chemist)
GEC-Marconi Avionics,
Edinburgh.

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