Does anyone know of articles, reports etc regarding the reliability of the Cu-Ni-Sn/Pb solder bond in comparison to the Cu-Sn/Pb solder bond. (The Ni plating is an electroless deposit). Martin Farrell (Chemist) GEC-Marconi Avionics, Edinburgh. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************