Mark Jones asked for references for the mathematical models of PTH
failure.  

The two that I have been able to track down are:

Mirman, B., A., "Mathematical Model of a Plated Through Hole Under a Load
Induced By Thermal Mismatch," IEEE Trans. on Comp. Hyb. and Manuf. Tech., Vol. 11, No. 4, 1988,
pp.506-511.

Oien, M. A.,  "A Simple Model for the Thermo-Mechanical Deformations of
Plated Through Holes in MultiLayer Printed Circuit Wiring Boards," 14th
Annual Proceedings, IEEE Reliability Physics Symposium, 1976, pp. 121-128.

If you don't have access to a library which will have these references,
email me directly and I can get them to you.


Mirman also cites these sources, but I have not yet been able to obtain
any of them:

Hagge, J. K., "Strain-induced failures in plated-through-holes," Proc.
Printed Circuit World Conference, 1980, pp.32-36.

Torres, L. A., "Thermally induced strain in plated through holes," Tech
Paper IPC-TP-510, Sept. 1984.

Steinberg, D. S., "PCB plated through hole thermal stress analysis,"
unpublished work, Boeing Aircraft Corporation, Seattle, WA, Oct. 1986.

Engelmaier, W., "Plated through hole failures in thermal cycling:
Analytical consideration," unpublished work, AT&T Bell Labs., Whippany,
NJ, May 1988.  


Cheers,  Andy

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