Hi Andy,
There is a PTH/PTV model that was developed from IPC accelerated round robin
data as well as data from Bell Labs and other sources, taht not only takes
geometric design factors and material properties into account, but also the
non-uniformities that one gets with actual product. This model was originally
published in Engelmaier, W., and L. Turbini, "Design for Reliability in
Advanced Electronic Packaging," Proc. Surface Mount International Conf., San
Jose, CA, August 1995, pp. 844-879, and an updated version is contained in
IPC-D-279, 'Design Guidelines for Reliable Surface Mount Technology Printed
Board Assemblies'. I would suspect that this model would serve you better.

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 973-543-2747
E-mail: [log in to unmask]  

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