Mr. Siu:

Tecknit LCC Fuzz Button Technology interposers have been used in similar 
military & space applications.
They provide solderless interconnections and are excellent for high shock & 
vibration uses.
What temperature range is involved?
The interposers are designed for each customer application.
They can be easily fastened to the PC board or other substrates.
Kindly fax me a device drawing for our review.

Regards,
Stephen Tetorka - 908 - 709 - 8230 (fax)

 ----------
From: Steve Siu
To: STETORKA; 'TECHNET@SMTP <[log in to unmask]>'
Subject: LCC solder joint
Date: Monday, June 09, 1997 8:37AM

Hello,

Our customer's product is to be used in aeroplane.  It has lot of
Leadless Chip Carrier (LCC) package IC.  The LCC's solder joint
cracked during the FCC vibration and thermal test.  Could anyone have
experience with similiar problem share it with me?  We are currently
looking looking into 2 different solutions:
1.  PCB finish plating and solder paste.
2.  Converting LCC to leaded package.
Other suggestions are deeply appeciated

Regards
Steve Siu

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