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June 1997

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Subject:
Re: FAB: RE: Question on Pad Leveling
From:
"EDDIE ROCHA" <EddieR@[192.9.200.50]>
Date:
Fri, 13 Jun 97 11:47:51 EDT
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text/plain
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text/plain (19 lines) 
Frank is on the right track. Due to HASL's wide window of thickness 
inconsistencies, we should all concern ourselves with 
coverage and solderability. Horizontal HASL units are an improvement 
but they too have a wide window (solder thickness achieved). 
 

thanks,

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