Two questions:

1.  I would like to know what others consider an ideal topside 
laminate board temperature during preheat. The "rule of thumb" we have been 
using is that we want this to be between 190 and 220 F (measured using a Wave 
Solder Optimizer and/or tape dots). We are using an alcohol-based water soluble 
flux and standard tin/lead solder at 495 F.

2. We are considering changing over to forced air convection preheaters, but are 
 concerned that this will have more of a tendency to dry out the flux. Again, we 
are using an alcohol-based water soluble flux. Any experiences here?




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