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June 1997

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Subject:
Tin / HASL
From:
sam mccorkel <[log in to unmask]>
Date:
Tue, 10 Jun 1997 13:29:13 -0400
Content-Type:
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Is it an accepted practice to tin plate ( for an etch resist ) and then hot
air solder level over the tin?
We're considering this for SMOTL finishes but have concerns about the tin
plated boards going into the HAL.
Does anyone know if we're asking for trouble or do other manufacturer's do
the same?

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