[log in to unmask] wrote:
> 
> topic of Pd seems to be very interesting these days - everyone is looking at
> it - at a glance. Please take note that there is a difference in a plated Pd
> deposit - and an electroless Pd deposit. Electroplated Pd - has the inclusion
> of organic additives that plate with the deposit, electroless Pd doesn't.
> There is a paper written by IBM in the 97 IPC Expo proceedings that i think
> could answer a lot of questions - but i know that in speaking with the
> circuit manufacturers - they are not making a distinction between the two
> type of deposits - while the board designers - or OEM's as they are called -
> are. Majority of OEM's have done a lot of in-house studies - the fabricators
> have not.
> 
> Regards
> 
> Richard Fudalewski
> Atotech Canada Ltd
> 
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So, I understand that there is a difference in the behaviour of Pd
platings during soldering,depending on their content in organic
additives?
What's good or bad? 
For what appliccation?
Are component vendors specifying what plating method is used?
Is there a difference in storage?
Is it important to specify the plating method in the drawing?
If so, how do you check it?

Best regards,

Gaby

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