Hi Technetters,

Given design:  2 sided mixed SMT/Thru-hole board.  Top is all SMT. Bottom (wave 
side) has approx: 
 12 SOIC-14
 5 SOIC-8
 20 SOT-23
 10 each of Tantalum A, B, C case sizes
 Predominantly 0805 R's and C's
 A few 1206 R's and C's
 (of course) Leads from 10 thru-hole components to be wave soldered on the 
bottom
SMT pad geometry is standard IPC.  SMT and Wave process is "No Clean"

Would you:
 A. Glue bottom SMTs (no paste) to be wave soldered later, or,
 B. Redundantly apply paste (still with glue) and reflow the bottom SMTs, 
before wave solder?

Comments explaining your choice, or any technical reference on this matter, 
would be much appreciated. 

Thanks and good day to all.

Barry Khor
Sr. Staff Specialist, Quality Eng.
Hughes Network Systems
San Diego, CA 

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