We are currently producing large quanties of blind via panels on standard
FR4 materials. This is causing a bottleneck at our resin removing operation,
prior to drilling, and I have been asked look at a more efficient method.

Our current procedure is Plasma desmear after bonding followed by a light
brush prior to drilling.

We have evaluated PTFE and other proprietary blocking films during the
bonding operation, but have found them to be too expensive,or they create
other problems due to 'dish down' at the via enterance. Allowing the resin
to flow onto the surface has proved the most effective method at this time.

I would be intrested to hear how other manufacturers remove resin from blind
via panels, and if they have any comments or suggestions on the procedure
stated above.    

yours in anticipation

Billy Shaw

Process Engineering Manager

Thomas Walter, Marlow, England, UK
     

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