John,
The palladium/gold acts as a good solderable surface and will retain
solderability for a long time. For example 8 micorinches of palladium with
an overplate of 6-8 micoinches of gold will retain solderability much better
than any of the single platings such as 15 microinches of gold over nickel.
It also eliminates that worry about gold embrittlement.
Phil Hinton
[log in to unmask]
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************