TECHNET Archives

June 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Thu, 12 Jun 1997 15:22:06 -0400 (EDT)
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines)
John,

The palladium/gold  acts as a good solderable surface and will retain
solderability for  a long time.  For example 8 micorinches of palladium with
an overplate of 6-8 micoinches of gold will retain solderability much better
than any of the single platings such as 15 microinches of gold over nickel.
 It also eliminates that worry about gold embrittlement.  

Phil Hinton 
[log in to unmask] 

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************


ATOM RSS1 RSS2