I am getting into similar processes, in deveoping my glueing, curing and wave
soldering, I 
realized that a board with SMTs glued on the bottom will not be workable to
stencil print
the top side paste. Thus I am going to paste place and reflow the top, then glue
and cure the bottom
components for WS later. 

One alternative I considered was to Paste, place reflow the top, and paste place
reflow the bottom, 
THEN add adhesive to the solder side smts so that now glue interferes with the
soldering.

However If the gluing is done properly, Glue interferance should not be a
problem.

Regards
Peter Roy
Toronto

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************