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June 1997

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Subject:
Fab: LPI soldermask
From:
sam mccorkel <[log in to unmask]>
Date:
Thu, 26 Jun 1997 13:01:39 -0400
Content-Type:
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Before solder masking we scrub our panels using a 320 bristle brush. What
TYPE of brush and grit SIZE is most recommended?

Suggested pre-bake cycles seem to vary from one source to another. What is
the most recommended time and temperature for baking panels just BEFORE
applying LPI solder mask?

We apply LPI ink using a DP-10 and are experiencing solder mask "puddling"
beside the holes. How can we eliminate this cosmetic problem?

All comments and suggestions are greatly appreciated!

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