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June 1997

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From:
"ddhillma" <[log in to unmask]>
Date:
Mon, 23 Jun 97 16:29:05 cst
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     Hello Rich-
     
     ANSIJ-STD-003 is currently under revision to an "A" status with quite 
     a few updates, changes, etc. Please contact me offline and I'll fill 
     in some of info that you may be looking for.
     
     
     Dave Hillman
     ANSIJ-STD-003 Task Group Chairman
     [log in to unmask]
     319-295-1615


______________________________ Reply Separator _________________________________
Subject: Solderability Tests of Boards
Author:  [log in to unmask] at ccmgw1
Date:    6/23/97 4:21 PM


     Hello,
        I had some difficulty with my E-mail just around the time I first 
     posted this. The problem is corrected , therefore here it is again. 
     Rich
     
     
______________________________ Forward Header __________________________________
Subject: Solderability Tests of Boards
Author:  [log in to unmask] at INTERNET 
Date:    6/11/97 9:04 AM
     
     Hello,
     
        I am interested in testing solderability of printed circuit boards.
     There are 5 techniques mentioned in ANSI/J-STD-003 "Solderability 
     Tests for Printed Boards". They are : Edge dip, rotary dip , float, 
     wave, and wetting balance. The first three are done in a solder pot. 
     There is another method called "SERA Testing" that is not mentioned.
        Do any of these prove reliable in predicting a boards performance
     during assembly? Is it better to age the samples before testing? If so 
     then is steam aging the best method?
        Interpretation of results seems to have a certain amount of
     latitude. Is there a comprehensive authoritative work on the subject.
        Some of the contacts for equipment manufactures mentioned in
     section 6 of the document mentioned above are no longer valid. Are 
     there still sources for this equipment?
        There is no source for wave solder testing equipment listed. Is
     there a lab scale unit available?
        I am interested in presenting a paper in September at the IPC
     Summit on PWB Surface Finishes and Solderability  in September titled 
     something like "Survey of Solderability Testing Techniques". I plan on 
     using information gathered on TECHNET in this paper. If you have 
     information and wish to assist please contact me.
     Thanks
     Rich
------------------------------------------------------------------
     Richard Olsen                Telephone (602)-232-9154 
     Continental Circuits Corp.   Main      (602)-268-3461 
     3502 East Roeser Road        Fax       (602)-268-0208 
     Phoenix Arizona              Pager     (602)-310-6245
     85040-2905                   Internet  [log in to unmask] 
     USA                    I make circuit boards,what do you do?
------------------------------------------------------------------
     
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