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Subject:	RE: Tin / HASL
From:	Ed Cosper <[log in to unmask]>
Date:	Tue, 10 Jun 1997 13:24:40 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (43 lines)

Sam,

I''m not  sure about "everyone else" but I have never heard of HAL over the tin plating. Now , I can't back this next statement up with any written document or study but...  It would seem to me that by introducing tin plated surfaces repetitively could eventually affect the SnPB composition ratio in the solder pot as well as the coated surfaces. On the surface tt just doesn't sound like a good practice for the HAL process.

Ed Cosper
Graphic Electronics Inc.
Tulsa OK

----------
From:  sam mccorkel[SMTP:[log in to unmask]]
Sent:  Tuesday, June 10, 1997 12:29 PM
To:  [log in to unmask]
Subject:  Tin / HASL

Is it an accepted practice to tin plate ( for an etch resist ) and then hot
air solder level over the tin?
We're considering this for SMOTL finishes but have concerns about the tin
plated boards going into the HAL.
Does anyone know if we're asking for trouble or do other manufacturer's do
the same?

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