Folks:
     
      The other day I was asked me the following questions on fatigue 
     properties of solder (joints and bulk):
     
     Why is there no data on High Cycle Fatigue (stress or load controlled, 
     high frequency fatigue) of solder? 
     
     My contention was that this (stress controlled failure) is not a 
     realistic mode because  fatigue failures of solder joints are 
     strain-driven.  EWven at room temperature, the large component of 
     temperature-dependent creep drives these stresses to near zero, 
     thereby making it a strain-driven failure and not stress related.
     
     Having being told so, they still want to either generate this data 
     themselves or want to located published data in the literature?
     
     Do you know of any source?
     
     How would you answer the question?
     
     Thanks for your help.
     
       Prasad Godavarti

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