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June 1997

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Subject:
LCC solder joint
From:
"Steve Siu" <[log in to unmask]>
Date:
Mon, 9 Jun 1997 08:37:46 -0800
Content-Type:
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Hello,

Our customer's product is to be used in aeroplane.  It has lot of 
Leadless Chip Carrier (LCC) package IC.  The LCC's solder joint 
cracked during the FCC vibration and thermal test.  Could anyone have 
experience with similiar problem share it with me?  We are currently 
looking looking into 2 different solutions:
1.  PCB finish plating and solder paste.
2.  Converting LCC to leaded package.
Other suggestions are deeply appeciated

Regards
Steve Siu  

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