Hello, Our customer's product is to be used in aeroplane. It has lot of Leadless Chip Carrier (LCC) package IC. The LCC's solder joint cracked during the FCC vibration and thermal test. Could anyone have experience with similiar problem share it with me? We are currently looking looking into 2 different solutions: 1. PCB finish plating and solder paste. 2. Converting LCC to leaded package. Other suggestions are deeply appeciated Regards Steve Siu *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************