Mr. Bailey is right with his information about material supplier.

Some more information:

IMS stands for insulated metal substrate. The copper foil is attached by
means of an filled adhesive with good thermal conductivity. Typical
thicknesses are 1 mm for the aluminum base (copper too is available as
base material), 75 micrometers for the adhesive and about 30 to 140
micrometers for the copper foil. Surface protection or overcoats are:
organic protection like GLI-coat, HAL, plated Sn or Ni/Au. DENKA
(company in Japan, i've got their german adress and their japanese, if
you are interested) is another supplier. They can provide aluminum on
copper foil (ideal for wire bonding process). Solder mask can be
applied.

Typical application is with high power devices due to the good overall
thermal conductivity. SMDs can be soldered, direct chip attach via
soldering and wire bonding is possible. High insulation resistance
between the copper conductors and the base plate is given (up to several
kilovolts). IMS can be processed by usual reflow soldering. Some
precautions must be taken due to the metal base plate (thermal issues).
Cleaning from solder fluxes is possible.

Hope this helps a little.


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